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Fluent Supports New Cadence Allegro System Interconnect Design Platform
Integration with Allegro platform ensures designers ability to
quickly and accurately predict thermal performance and issues at the
IC package, PCB and system level
LEBANON, N.H.—(BUSINESS WIRE)—March 10, 2004—
Fluent Inc., the world leader in providing computational fluid
dynamics (CFD) software and consulting services, today announced its
support of the new Cadence(R) Allegro(R) system interconnect design
platform. The Allegro platform delivers a revolutionary, new
generation co-design methodology that promotes collaboration across
the entire design chain, including designers of I/O buffers,
integrated circuits (ICs), IC packages and PCBs. As a member of the
Cadence Connections Program, Fluent has access to software and
applications notes, ensuring open collaboration that benefits mutual
customers. Fluent has integrated its analysis and design solution,
Icepak, and a soon to be released product, IceBoard, with the Allegro
platform. Icepak software has been addressing the specific needs of
electronics designers for years. Its ability to help designers
understand and favorably manipulate their designs for maximum cooling
is becoming world-renowned. This integration allows designs to quickly
and accurately predict any thermal performance and issues at the IC
package, PCB and system level as a single integrated solution.
"Fluent is a proud member of the Cadence Connections Program.
Being able to seamlessly integrate our tools with the Allegro platform
has helped us create low cost, high quality, high performance
products. Using the EDA database from Allegro does not require our
thermal designers to re-create existing geometry, component or power
locations. This reduces errors in the model and lowers our cycle time.
In a world where customers expect the best, we turn to the Allegro
platform to help us meet those demands head on," said Paul Bemis,
Fluent's Vice President of Marketing.
As ICs get faster and generate and consume more power, the need
for thermal design becomes very challenging, and can cause major
design bottlenecks at the IC package, PCB and system integration
levels. Performing thermal design at the inception of the design
process could mean the difference between success and failure. Teams
of electrical, mechanical and packaging engineers have to work
together to achieve this goal. A smooth product design flow can be
achieved by interoperability of the various design tools, specifically
for thermal analysis. Board level layout and component libraries can
allow engineers to create thermal models that can be used at the IC,
board or system level.
"Cadence Design Systems is pleased that Fluent has integrated
their solutions with the Allegro platform. We feel that this is a
mutually beneficial partnership between the two companies and look
forward to the new solutions that Fluent has to offer," said Jamie
Metcalfe, Vice President of Strategic Marketing for the
Silicon-Package-Board Business Unit, Cadence.
About the Cadence Allegro platform
The Cadence(R) Allegro(R) system interconnect design platform
optimizes and accelerates high-performance, high-density interconnect
design. The Allegro platform delivers proven, best-of-breed design and
analysis tools to support a new generation co-design methodology that
promotes collaboration across the entire system design chain.
Electronics manufacturers will benefit from the Allegro platform's
ability to minimize design iterations within and between the design
domains of IC, package, and PCB design. The new platform provides a
common constraint-driven flow across design entry, signal and power
integrity, and comprehensively addresses the implementation of system
interconnects. For more information, please go to
http://www.cadence.com/products/si_pk_bd/index.aspx.
About the Cadence Connections Program
The Cadence Connections Program promotes open interoperability in
all areas of electronic design including digital, custom IC,
analog/mixed-signal and PCB design. By attracting best-in-class
partners, Cadence offers the industry's largest collection of
third-party solutions operating fully with the Cadence suite of design
tools. The Connections Program has over 120 member companies working
toward developing an optimized silicon design chain for customers.
Information about the Connections Program may be found at
http://www.cadence.com/partners/connections/.
About Fluent
Fluent is the world's largest provider of computational fluid
dynamics (CFD) software and consulting services. Fluent's software is
used for simulation, visualization, and prediction of fluid flow, heat
and mass transfer, and chemical reactions. It is a vital part of the
computer-aided engineering (CAE) process for companies around the
world and in almost every manufacturing industry. Using Fluent's
software, product development, design and research engineers build
virtual prototypes and simulate the performance of proposed and
existing designs, which helps them to optimize, troubleshoot,
scale-up, and retrofit. Use of CFD software reduces time-to-market by
reducing the need for costly physical testing and prototyping.
Fluent's corporate headquarters is located in Lebanon, New
Hampshire, USA. Fluent's European headquarters are located in
Sheffield, England, with local offices in Belgium, France, Germany,
Italy, and Sweden. Fluent's Asia Pacific headquarters are located in
Tokyo, Japan. Its CFD software is also available around the world
through joint ventures, partnerships, and distributors in Korea,
Australia, Brazil, China, Taiwan, the Czech Republic, Middle East, and
most European countries.
Fluent is a subsidiary of Aavid Thermal Technologies Inc.
Additional information on Fluent's products can be obtained on the
World Wide Web at www.fluent.com or by e-mailing info@fluent.com. More
information on Aavid Thermal Technologies is available at
www.aavid.com.
Icepak is a joint development of Fluent Inc. and ICEM CFD
Engineering.
Contact:
Fluent Inc.
Jennifer Correa, 800-445-4454 Ext. 668
jrc@fluent.com
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